产品服务
Testingrvice
Wafer Probe Test (Tri-Temp Test)
Final Test (Tri-Temp Test)
WLCSP Test
Laser repair
Backend Service
Burn-in
Lead Scan
Tape & Reel
Drop Shipment
Probe Card Center
RMA
Test Engineering service
Testing Program development
Load board /probe card/DUT Board design
Fixture/ Changkit/ socket design
Testing Equipment
Mixed Signal & Logic
Chroma：3600、3360、3360P
LTXC：D10、Sapphire、LTX-EX/MA、ITS9000EXA、ITS9000CV、SC212/312
Teradyne：Ultra FLEX、FLEX、J750、Catalyst
Verigy：93000、V101
VTT：V7100
Memory
Advantest：T5581H、T5335、T5585、T5382A、T5365、T5335P、T5371、T5377S、T5377、T5372、T5592
LTCX：Kalos
RF
LTCX：LTX Fusion-CX、LTX Fusion-MX、ASL3K
Sigurd：SG90000RF
Teradyne：Ultra-Flex、FLEX-RF
Verigy：93KPSRF、84000
Power
Amida：1000
LTCX：ASL1000
Spandnix：SX3010、1300
Tesec：881
Teradyne：Eagle-364、ETS-88
Assembly Service
. MEMS  Assembly
. Multi-chip ICs Assembly
. Wafer  grinding  and  chip  sawing
. RF  modules  Assembly
 . Optical  device  Assembly
. Analog / Power ICs Assembly

QFN
1.6x1.6mm upward and flexible package size
6 upward pin counts
0.4~0.65mm lead pitch
Improved thermal and electrical performance
Green finish available
Full in house design ability
SOT/TSOT
2.9x1.6mm package size
3、5、6、8 pin counts
0.95、0.65mm lead pitch
SOT die thickness 1.10mm
TSOT die thickness 0.75mm
JEDEC standard outlines
RF
3x3mm to 27x27mm package size
7 to 775 pin counts
0.4mm lead pitch
High through put
Pb-free lead finish available
Excellent electrical and thermal performance
Full in house design ability

MEMS
Full in-house design ability
Cavity packaging structure
Excellent thermal performance
Special package design
JEDEC standard outlines

SSOP
150 mils package size
16/20/24 pin counts
0.65mm lead pitch
Full in house design ability
JEDEC standard outlines
Green product
R&D Engineering

质保体系证书
ISO9001
ISO14001
ISO16949