半导体晶圆设备供应商Lam Research Corporation日前发布了2300 Versys Kiyo3x刻蚀设备，关键尺寸（CD）一致性达到1nm，为双重图样曝光过程所面临的CD及重叠（overlay）挑战提供了解决方案。另外，这套设备还配置有升级选项，灵活经济有效地对高k金属栅极、硬模窗口（hardmask open）、浅沟槽隔离及应变硅等进行刻蚀。
Lam Research集团副总裁兼刻蚀业务总经理Richard A. Gottscho表示：“当业界向双重图样曝光过渡时，刻蚀工艺变得尤为重要。Kiyo3x系列具有出众的均匀性、吞吐能力以及重复性，有力拓展了市场领先的刻蚀家族系列产品。另外设备所配有的升级方案，给客户带来资本投资价值的最大化。”
目前已有数套Kiyo3x设备在各大晶圆工厂安装，应用于新兴工艺。
Lam Research Corporation Releases 2300? Versys? Kiyo3x Conductor Etch
Series
Kiyo3x delivers CD uniformity of 1 nm, enabling advanced applications such
as double patterning, and is available as a series of cost-effective
upgrade options.
FREMONT, Calif., June 24, 2008—Lam Research Corporation (NASDAQ: LRCX), a
major supplier of semiconductor wafer fabrication equipment and services,
today introduced the 2300 Versys Kiyo3x conductor etch series. Innovative
Kiyo3x technologies deliver CD uniformity of 1 nm across the wafer, which
provides enabling capability for managing the challenging CD and overlay
budgets of emerging double patterning applications. Kiyo3x
field-upgradeable options provide a flexible, cost-effective approach for
addressing a rapidly diverging range of challenging etch applications,
including high-k/metal gate, hardmask open, shallow trench isolation, and
strained silicon.
“As the industry transitions to double patterning as a key enabler of
advanced device scaling, etch plays an increasingly important role in
pattern shrinking. With the Kiyo3x series, we have extended our
market-leading conductor etch product family to provide better uniformity,
productivity, and repeatability to enable a range of the most complex as
well as emerging critical etch applications on our customers’ technology
roadmaps,” said Richard A. Gottscho, Lam Research group vice president and
general manager, Etch Businesses. “By providing these capabilities as a
configurable set of upgrade options, we allow our customers to maximize the
value of their capital investments.”
As the third generation of the Kiyo? product line, the new Kiyo3x series
includes improvements in wafer temperature control that enable radial
tuning for edge control and profile shaping. These improvements, coupled
with enhanced reactor symmetry, result in CD uniformities of 1 nm, 3?sigma
variation. With advanced, proprietary pre-coat and post-etch chamber clean
techniques, every wafer sees the same environment for superior
repeatability, as well as high uptime and yield. For complex film stacks
such as high-k/metal gate, the Kiyo3x provides multi-film etch capability
in a single chamber, which results in a 50-to-100 percent productivity
advantage over a two-chamber approach.
Multiple Kiyo3x systems have been installed at major customer sites in
regions worldwide to address a variety of emerging applications.
